E-newsletter / Product Highlights
TIMTOS 2025

Solving Wafer Production Challenges with Centerless Grinding Solutions

This JHC-2416T-CNC centerless grinding solution can be tailored to meet the grinding requirements of wafer materials, ensuring that the final products meet the specified dimensions and surface finish. Furthermore, it helps improve the quality of finished products by reducing defects and increasing yield.

The machine offers several advantages, making it capable of meeting the processing demands:

* The grinding wheel spindle is a high-precision bearing type with grease lubrication, eliminating the need to set up an external hydraulic tank. This design simplifies maintenance.

* The machine features grinding and regulating wheels with a symmetrical axis feeding. There is no need to adjust the loading / unloading device after the grinding or regulating wheels wearing.

* Machine is equipped with a 405mm wide grinding wheel for heavy grinding. It can support workpieces with diameters range from Ø6 to Ø230mm.

* The CNC program controls automatic wheel dressing to achieve high work efficiency and product stability. It improves overall quality, increase productivity and minimize manpower requirements.

* The machine can be equipped with an automatic loading and unloading device to enhance production efficiency.

Solving Wafer Production Challenges with Centerless Grinding Solutions


Jainhher Machine Co.,Ltd
Website: www.jainnher.com
Contact Person: William Lee / Export Sales Manager
Tel: +886-4-23585299
Email: saledep@jainnher.com

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Taiwan External Trade Development Council
Taiwan Association Of Machinery Industry

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